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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

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Brand Name : ZIITEK

Model Number : TIF3160

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Application : PCB board

Heat Capacity : 1 l /g-K

Color : gray

Thickness : 4mmT

Hardness : 35 Shore 00

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2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

The TIF3160 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.


Features:

> Perfect heat sinking
> Good thermal conductive: 2.8 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Thcikness: 3mmT


Applications:

> Automotive engine control units

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps

> Micro heat pipe thermal solutions

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment

> RDRAM memory modules

> Cooling components to the chassis of frame

Typical Properties of TIF™3160
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
*** 10mils / 0.254 mm 0.21
20mils / 0.508 mm 0.27
Specific Gravity
2.41 g /cc ASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
27 Shore 00 ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

1.00

120mils / 3.048 mm

1.07
Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
6.3X1012Ohm-meter ASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V-0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
2.8 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.
2.8W / MK Conductivity Thermal Gap Filler Pad For PCB Board Applicated

Product Tags:

thermally conductive filler

      

thermal conductivity silicone

      

2.8W / MK Thermal Gap Filler

      
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