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Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

Name: Ul Recognized 30 WMk Thermal Gap Filler Material 25mmt For Notebook
Brand: ZIITEK
Price: 1 USD

Wholesale Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook from china suppliers

Brand Name : ZIITEK

Model Number : TIF1100-30-06US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 3.0 W/m-K

Hardness : 18 Shore 00

Density : 3.0 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT

The TIF1100-30-06US  use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-30-06US.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness:2.5mmT

>hardness:18 shore00

>Colour: white

>Easy release construction

>Electrically isolating

>High durability

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF1100-30-06US Series
Color	white	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	18 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgassing(TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

FAQ:

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

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Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

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